ESTnet Premier Member SPTS Technologies, an Orbotech company and a supplier of advanced wafer-processing solutions for the global semiconductor and related industries, received a repeat order for its Sigma fxP 300mm physical vapor deposition (PVD) solutions from JCAP Corporation (Jiangyin Changdian Advanced Packaging Co., Ltd), a JCET company and a leading Chinese advanced packaging house specializing in wafer-level packaging services to global semiconductor companies. The additional Sigma fxP PVD systems will enable JCAP to more than double the capacity of its flip chip packaging line.
“With the rapidly developing semiconductor industry in China, we have seen increasing investment by domestic packaging companies to add capacity in order to keep pace with demand,” stated Kevin Crofton, President of SPTS Technologies and Corporate Vice President at Orbotech. “JCAP is a leader in bumping services for wafer-level packaging in China and is gearing up for the extra capacity anticipated to be required to meet the needs of its customer base. Wafer-level packaging is a fast-growing but extremely cost-sensitive activity, so customers appreciate the benefits of our Sigma systems. They are able to achieve more than 30% cost of ownership savings over traditional PVD because of our unique approach to wafer degassing, high-rate pre-clean, and long intervals between maintenance events.”